Abstract: Standardized measurement of the centroid is a fundamental technology in scientific research and high-precision mass metrology. However, a unified standard for evaluating the accuracy of such ...

A new imaging breakthrough combines ultrasound and light-based techniques to generate vivid 3D images that show both tissue structure and blood vessel activity. Developed by researchers at Caltech and ...

Whether for drug screening or toxicity testing, stem cell-based 3D tissue models are key to biomedical research. However, producing cell aggregates in bioreactors is highly complex and cost-intensive.

Additive manufacturing has revolutionized manufacturing by enabling customized, cost-effective products with minimal waste. However, with the majority of 3D printers operating on open-loop systems, ...

Project Genie allows people outside of Google to try the company's Genie 3 world model. (Google) This past summer, Google DeepMind debuted Genie 3. It’s what’s known as a world world, an AI system ...

Researchers at the Department of Energy’s Oak Ridge National Laboratory have developed a novel extrusion system that combines multiple 3D-printing extruders into a single, high-output stream via ...

4D Technology's handheld, portable devices like InSpec and InSpec XL provide quick, accurate measurements of complex surfaces and textures in shop environments. Enhanced metrology reduces rework, ...

In a proof-of-concept study funded by the National Institutes of Health, researchers from the Keck School of Medicine of USC and the California Institute of Technology (Caltech) have shown that an ...

Lincotek has been granted FDA 510(k) clearance for its 3D printing-enabled SpineLinc Anterior Cervical Implant System. The SpineLinc Anterior Cervical Implant System is manufactured and assembled at ...

3D Systems is adding up to 80,000-square-feet to its Littleton, Colorado facility as part of its plans to enhance its Aerospace & Defense Application Center of Excellence. The Littleton facility has ...

Abstract: A novel chip stacking method with low thermal resistance for 3D integration of a large number of memory chips and processor chips is proposed, namely Massive Orthogonal Stacking Assembly of ...