At the recent Flash Memory Summit (FMS) 2022 the engineering team at YMTC have unveiled its latest X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. YMTC’s Xtacking 3.0 architecture ...

Deep vertical holes and re-entrant features challenge the best metrology methods.

Check out more coverage of the 2022 Flash Memory Summit. Memory chip giants are upping the ante on each other with new generations of 3D NAND flash. 3D NAND chips resemble skyscrapers in which floors ...

Kioxia has introduced an industrial-grade series of its 3D flash memory BiCS FLASH. Sampling commenced earlier this year, with mass production expected late in the fourth quarter of 2022. The new ...

NAND flash technology is on a roll with advancements in cell structure and the subsequent boost in storage density. That allows this non-volatile-memory (NVM) chip to deliver faster throughput and ...

NEO Semiconductor has announced that it has developed the "world's first 3D NAND-like DRAM cell array," which aims to increase DRAM chip density using established 3D stacking technology. Designed to ...

This content was produced in partnership with Micron. In the wide world of computing, sometimes there’s innovation you can see — like a processor that’s larger than others with increased capabilities, ...

What just happened? Micron has become the first in the industry to ship ninth-generation TLC NAND in SSDs, starting with a blazing-fast new model called the 2650. As AI workloads become more prevalent ...

Why many commonly held beliefs about 3D flash memory are inaccurate. Details about some of the challenges that 3D flash memory faces as it continues to evolve. Insights into how adding layers affects ...